Penang, Malaysia (January 2026) – Driven by innovation in customized solutions, Pentamaster proudly introduces its next-generation wafer prober series designed for silicon photonics applications.
Silicon photonics has emerged as a key enabling technology for high-speed data communication, advanced computing and next-generation architectures. Unlike conventional semiconductor devices that rely solely on electrical signals, silicon photonics integrates optical and electronic components on a single platform. This added complexity significantly increases the challenges associated with testing and characterization. As a result, wafer-level probing plays a critical role in ensuring device performance, yield optimization, and overall cost efficiency.
Pentamaster’s CPO and silicon photonics test platform delivers precise optical and electrical characterization at the wafer level, supporting advanced packaging requirements and enabling validation of high-bandwidth, low-latency interconnects for next-generation data centre and AI applications.
The platform features a 6-axis optical probe system with sub-micron alignment accuracy, supporting both grating and edge couplers interfaces across standard optical communication bands, including O-, E-, C-, and L-bands. Designed for Lab-to-Fab integration, the system supports both single- and double-sided probing, allowing flexible deployment across R&D, pilot lines, and high-volume manufacturing environments. Configurable test sequences, CSV and STDF data output, and built-in GR&R tools enable robust performance monitoring and statistical process control.
Comprehensive wafer-level test coverage includes electrical measurements such as DC parametric testing, high-speed interface characterization, functional verification, and power integrity analysis. Optical measurements include optical power, wavelength, spectral linewidth, LIV characteristics, responsivity, insertion and return loss, as well as polarization-dependent and wavelength-dependent loss. Combined with integrated vision inspection and precise optical alignment, the platform delivers accurate as well as repeatable wafer probing prior to packaging.
By unifying high-precision optical and electrical testing in a single platform, Pentamaster’s solution ensures device quality, improves yield, and supports seamless integration into advanced packaging flows—providing a complete solution for high-performance silicon photonics and co-packaged optics applications.
Discover how Pentamaster’s next-generation wafer prober series can enhance your silicon photonics workflow. Contact our team today to learn more.